Vertiv™ Tackles AI Data Center Challenges with Advanced Power and Cooling Solutions

27 Mar.,2025

Vertiv™ tackles the challenges of high-density power supply and cooling in AI data centers by offering advanced, integrated solutions for energy management and thermal management, ensuring reliability and efficiency as power demand increases.

 

As AI technology rapidly develops, do you know which industry has been most affected? In the age of AI, all industries will be reshaped, and data centers, as the frontlines of AI transformation, are naturally at the forefront.

There is a general consensus in the industry that in order to gain an advantage in the AI wave, one must have strong AI computing power support, and data centers are the core infrastructure that ensures computing power requirements.

With the rapid development of AIGC (AI-Generated Content) business needs, the power of chips, servers, and cabinets has been increasing. High-density AI applications have become one of the most prominent features of AI data centers.

What unprecedented challenges do data centers face in the face of high-density trends?

Vertiv™ Tackles AI Data Center Challenges with Advanced Power and Cooling Solutions

High Density Poses Challenges to Both Power and Cooling

For AI data centers, the complexity brought by high density is not only the high-density deployment of equipment, but also solving two key problems—power supply and cooling.

Challenge 1: How to Efficiently Deliver Power from the Grid to Cabinets with a Surge in Power Demand?

Vertiv™ Tackles AI Data Center Challenges with Advanced Power and Cooling Solutions

In the AI era, the shift from traditional CPUs to GPUs as core computing devices has also led to greater power requirements. For example, the power capacity of a single cabinet has surged from 5 kW to 40 kW, an eightfold increase.

How to ensure high reliability and availability of power transmission, reduce power transmission losses, effectively cope with cluster overloads and AI load characteristics, and save space for the increasingly large power distribution equipment — these are urgent challenges that need to be solved.

Challenge 2: How to Quickly and Efficiently Manage Heat from High-Power Equipment?

Vertiv™ Tackles AI Data Center Challenges with Advanced Power and Cooling Solutions

 

With the increased heat generation from high-power equipment, how to quickly and efficiently manage the heat? As power density continues to rise, traditional cooling solutions can no longer meet the cooling needs of AI data centers.

In current AI data center designs, cooling solutions must balance high-density heat dissipation and energy efficiency.

Breaking the Challenge of Data Center with Full Chain Path Solutions

When high-density power and cooling demands come together, how should we respond? Vertiv™ believes that simply adopting popular solutions in the market will not solve the problem.

We need forward-thinking, a global perspective, and innovative solutions that best match the requirements to provide the optimal answer to the challenges faced by data centers.

In response to new needs, Vertiv™ has implemented innovative solutions based on the idea of "coordinated cooling and power, reliable integration," which break the AI data center construction challenges.

Power Management: Full Chain Reliability Facing Surge in Power Demand, Maximizing Resources to Build Power "Superhighways"

Vertiv™ relies on a complete product line, providing products with a 50% increase in capacity, prefabricated power modules that maximize space, high-density reliable UPS, and smart medium-power distribution units, fully meeting the power switching and distribution needs of facilities/outdoor, rooms/rows, and cabinets/servers.

Thermal Management: Full Chain "Cooling" Solutions for High-Density Heat Dissipation Needs

Vertiv™ adopts a "wind-liquid stack" technology approach, developing complete thermal management solutions with rich air and liquid cooling products. The solutions include high-density air cooling and air-liquid hybrid solutions to address variations in cabinet power density.

As AI technology continues to develop and be applied, the power density of data centers will further increase, and IT infrastructure such as power and cooling systems will evolve in the direction of miniaturization and improved efficiency.

Vertiv™ will continue to adhere to technological innovation, developing better-matching product solutions to support the development of AI data centers.